Apple Announces 5nm A14 SoC - Meagre Upgrades, Or Just Less Power Hungry?
Amongst the new iPad and Watch devices released today, Apple made news in releasing the new A14 SoC chip. Apple’s newest generation silicon design is noteworthy in that is...
127 by on 9/15/2020
Apple Announces new 8th gen iPad with A12, iPad Air with 5nm A14 Chip
This year’s September Apple event has been relatively unusual, not only because of the pandemic and online-only nature of the show, but also because amongst the new hardware releases...
68 by on 9/15/2020
The Apple 2020 Fall Event Live Blog - Starts at 10am PT (17:00 UTC)
Today Apple is hosting its 2020 fall launch event. This year due to circumstances, we'll be going virtual and remote, however we'll still be live blogging the show for...
52 by on 9/15/2020
Samsung's Note20 Ultra Variable Refresh Rate Display Explained
In August 2020, Samsung launched the new Note20 Ultra – an interesting device that we have on our review test bed. It's safe to say that over the last...
43 by on 9/8/2020
SiPearl Lets Rhea Design Leak: 72x Zeus Cores, 4x HBM2E, 4-6 DDR5
In what seems to be a major blunder by the SiPearl PR team, a recent visit by a local French politician resulted in the public Twitter posting in what...
28 by on 9/8/2020
Arm Announces Cortex-R82: First 64-bit Real Time Processor
Arm is known for its Cortex range of processors in mobile devices, however the mainstream Cortex-A series of CPUs which are used as the primary processing units of devices...
28 by on 9/3/2020
Samsung Launches New Galaxy Z Fold2 at $1999
Samsung’s new Galaxy Z Fold2 had been originally announced several weeks ago alongside the Note20 series, however the company had been delaying the official launch of the phone until...
32 by on 9/1/2020
The ASUS ZenFone 7 Pro Review: The Triple Flip-Camera
ASUS last week released the brand new ZenFone 7 and ZenFone 7 Pro series, and today’s we’re ready to publish our testing of the company’s newest “mainsteam” flagship device. This...
31 by on 9/1/2020
Qualcomm Announces Snapdragon 732G: 730G Gets a Speed Bump
Today Qualcomm is announcing an update to its Snapdragon 730G platform, introducing the higher-binned Snapdragon 732G. The new chip gives the platform a slight boost in terms of clock...
16 by on 8/31/2020
Marvell Refocuses Thunder Server Platforms Towards Custom Silicon Business
Yesterday during Marvell’s quarterly earnings call, the company had made a surprise announcement that they are planning to restructure their server processor development team towards fully custom solutions, abandoning...
42 by on 8/28/2020
The ASUS ROG Phone III Review: A 144Hz 6000mAh Beast With Caveats
ASUS’s ROG Phones over the last few years have been devices of interesting differentiation, with the company delivering experiences that stood out from the crowd in one way or...
72 by on 8/28/2020
ASUS Announces ZenFone 7 Series: The Triple-Flip Camera - Hands-On
Today ASUS is announcing its follow-up to its innovative flip-camera design that was first introduced last year with the ZenFone 6. This year’s ZenFone 7 series, consisting of the...
80 by on 8/26/2020
2023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package
High-performance computing chip designs have been pushing the ultra-high-end packaging technologies to their limits in the recent years. A solution to the need for extreme bandwidth requirements in the...
35 by on 8/25/2020
TSMC’s Version of EMIB is ‘LSI’: Currently in Pre-Qualification
Whilst process node technologies and Moore’s Law are slowing down, manufacturers and chip designers are looking to new creative solutions to further enable device and performance scaling. Advanced packaging...
19 by on 8/25/2020
TSMC Details 3nm Process Technology: Full Node Scaling for 2H22 Volume Production
At TSMC’s annual Technology Symposium, the Taiwanese semiconductor manufacturer detailed characteristics of its future 3nm process node as well as laying out a roadmap for 5nm successors in the...
58 by on 8/24/2020
Hot Chips 2020: Marvell Details ThunderX3 CPUs - Up to 60 Cores Per Die, 96 Dual-Die in 2021
Today as part of HotChips 2020 we saw Marvell finally reveal some details on the microarchitecture of their new ThunderX3 server CPUs and core microarchitectures. The company had announced...
27 by on 8/17/2020
Samsung Announces "X-Cube" 3D TSV SRAM-Logic Die Stacking Technology
Yesterday, Samsung Electronics had announced a new 3D IC packaging technology called eXtended-Cube, or “X-Cube”, allowing chip-stacking of SRAM dies on top of a base logic die through TSVs. Current...
21 by on 8/14/2020
Microsoft Opens Pre-Orders for Surface Duo - US Only
Late last year in October, Microsoft had announced the Surface Duo, the company’s first ever Android device and first-party smartphone (if you can call it that) release in years...
71 by on 8/12/2020
Samsung Display Announces First VRR Mobile Display - Inside Note20 Ultra
By now we’ve become quite familiar with high refresh-rate displays in the mobile space, as the first pioneering 90Hz devices last year have now evolved into even faster refreshing...
31 by on 8/11/2020
US Appeals Court Reverses Antitrust Ruling in FTC vs Qualcomm
It’s been over three years since the United States FTC had charged Qualcomm with antitrust violations over cellular modem patents and business practices. That suit ultimately received a ruling...
23 by on 8/11/2020
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