BAPCo Publishes SYSmark 2018
One of the bigger consortiums for developing benchmarks is BAPCo. Over the years the company has released a variety of benchmarking tools, such as MobileMark, TabletMark, and SYSmark. This...
18 by on 8/17/2018Intel Server Roadmap: 14nm Cooper Lake in 2019, 10nm Ice Lake in 2020
At its Data-Centric Innovation Summit in Santa Clara today, Intel unveiled its official Xeon roadmap for 2018 – 2019. As expected, the company confirmed its upcoming Cascade Lake, Cooper...
55 by on 8/8/2018Intel Datacenter Summit 2018 Live Blog
We're live here at Intel HQ in Santa Clara for the company's 2018 Datacenter Summit. The most lucrative part of Intel's business, the company is looking to pivot entirely...
19 by on 8/8/2018Flash Memory Summit 2018, Yangtze Memory Technology Keynote Live Blog: Unleashing 3D NAND
The final talk of this session is from Yangtze Memory Technology (YMTC). We published their announcement this week, but they have set a very interesting talk for the show...
5 by on 8/7/2018Flash Memory Summit 2018, SK Hynix Keynote Live Blog: NAND Development
Second keynote of the session is SK Hynix
1 by on 8/7/2018Flash Memory Summit 2018, Micron Keynote Live Blog: QLC Flash
The afternoon keynote session has talks from Micron, SK Hynix, and YMTC, speaking all about future Flash products. This first talk is titled 'QLC Flash: Metting the Challenges of...
0 by on 8/7/2018Flash Memory Summit, Western Digital Keynote Live Blog
Second Keynote for us: Western Digital
0 by on 8/7/2018Flash Memory Summit, Toshiba Keynote Live Blog
We're here at Flash Memory Summit! One of the first keynotes of the event is Toshiba, speaking about their use of Flash.
1 by on 8/7/2018Update on Xeon W: Turbo Tables
Last week we published our Xeon W review - Xeon W is the new name for Intel's Xeon E3-1600 series, but effectively replaces both the E5-1600 and E5-2600 chips...
26 by on 8/7/2018More Details About the ZhongShan Subor Z+ Console, with Custom AMD Ryzen SoC
One of the exciting elements from last week’s coverage was the announcement of the upcoming Chinese market PC and Console, from Zhongshan Subor, featuring some AMD custom silicon. Through...
36 by on 8/6/2018MRAM Developer Day, IBM Keynote Live Blog
Third Keynote in this session is from IBM Research: STT-MRAM is Ready for Applications Today.
0 by on 8/6/2018MRAM Developer Day, GlobalFoundries Keynote Live Blog
Second Keynote today is from GlobalFoundries, Everspin's MRAM partner.
1 by on 8/6/2018MRAM Developer Day, Everspin Keynote: The MRAM Revolution (9:15am PT, 4:15pm UTC)
Prior to Flash Memory Summit, the first order of business is the MRAM Developer Day. The key talks today revolve around Everspin, a leader in MRAM Technology, GlobalFoundries, and...
3 by on 8/6/2018The AMD Threadripper 2 Teaser: Pre-Orders Start Today, Up to 32 Cores
The biggest news to come out of Computex, AMD’s second generation of its Ryzen Threadripper platform, is almost here. Today’s announcement is all amount images, speeds and feeds: specifications...
105 by on 8/6/2018Motorola Enables 5G: A Moto Mod for the z3
The concept of modular phones has gone from non-existent, to completely modular everything, and back again. The more you can embed into a phone at once, the slimmer the...
13 by on 8/6/2018AMD Creates Quad Core Zen SoC with 24 Vega CUs for Chinese Consoles
AMD has cornered the x86 console market with its handy semi-custom mix of processors and graphics. While we slowly await the next generation of consoles from Microsoft and Sony...
58 by on 8/3/2018The Intel Xeon W Review: W-2195, W-2155, W-2123, W-2104 and W-2102 Tested
Anyone looking at a high-end Intel system has three choices: Core i9, Xeon W, or the larger socket Xeon Scalable. Those first two both use the LGA2066 socket, and...
74 by on 7/30/2018Ian on the iMore Vector Podcast: Discussing Core i9 and Thermal Throttling
On Monday this week I was invited onto the Vector podcast, one of the popular Apple-focused podcasts, run by iMore’s Rene Ritchie. In the podcast we discuss Intel’s product...
12 by on 7/24/2018Intel and Micron To Dissolve 3D XPoint Partnership After 2019
A press release from Intel today has clarified the state of the 3D XPoint Joint Venture the company has with Micron. Currently Intel and Micron co-developed the new class...
19 by on 7/16/2018Intel To Acquire eASIC: Lower Cost ASICs in FPGA Design Time
Along with the other announcement today, Intel is also announcing that it will acquire a company called eASIC which develops FPGA-like design tools to roll out ‘structured ASICs’. These...
18 by on 7/12/2018